Producing printed circuit boards can be a costly procedure. If not done correctly, the circuit boards can be put at risk of being damaged or destroyed during production, transportation, or assembly. Panelizing your printed circuit boards is an excellent way to not only ensure their safety during production but also to reduce your overall costs and production time during the process. Here are some methods of panelizing your printed circuit boards, as well as some common challenges faced during this process.
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How will the heat generated by a laser beam affect my board and components during depaneling? Will it melt edge components into an ugly heap? Or demolish thin flex materials into an unrecognizable blob? We get these worst case scenario questions all the time from PCB designers and manufacturers who have relied on mechanical routers, manual cutters, and other traditional depaneling machines throughout their careers. So it is no wonder that there’s an ongoing concern about a laser’s heat affective zone (HAZ), and the thermal effect on edge components in particular.
It seems like there are more myths about UV laser depaneling than there are about the Loch Ness Monster. But unlike old Nessie, UV laser depaneling myths are much easier to debunk.
