Producing printed circuit boards can be a costly procedure. If not done correctly, the circuit boards can be put at risk of being damaged or destroyed during production, transportation, or assembly. Panelizing your printed circuit boards is an excellent way to not only ensure their safety during production but also to reduce your overall costs and production time during the process. Here are some methods of panelizing your printed circuit boards, as well as some common challenges faced during this process.
Depaneling an array of assembled circuit boards can be a huge time and money saver for the PCB manufacturing industry. Printed circuit boards can be lumped together en masse in panels and separated after all of the individual boards on the panel have been populated with components. The process of depaneling can be complex because of the massive amount of circuit boards types. With so many things to keep track of, there can be complications, but they can be easily avoided with proper data analysis and preparation.
Depaneling is a process used by PCB manufacturers to unpackage shipments of circuit boards without damaging them. Manufacturers can save a lot of time and money in the long run if this process is done effectively. Depaneling can be a complicated process sometimes, as there are many different types of circuit boards and methods of depaneling. This can lead to unnecessary stress which will make the whole process a lot less fun than it needs to be. Here are some of the different types of depaneling and how to avoid stress during each one.
How will the heat generated by a laser beam affect my board and components during depaneling? Will it melt edge components into an ugly heap? Or demolish thin flex materials into an unrecognizable blob? We get these worst case scenario questions all the time from PCB designers and manufacturers who have relied on mechanical routers, manual cutters, and other traditional depaneling machines throughout their careers. So it is no wonder that there’s an ongoing concern about a laser’s heat affective zone (HAZ), and the thermal effect on edge components in particular.
It seems like there are more myths about UV laser depaneling than there are about the Loch Ness Monster. But unlike old Nessie, UV laser depaneling myths are much easier to debunk.