Until recently, the creation of efficient Printed Circuit Board layouts wasn’t exactly a pressing issue. Electronic devices were large, and PCBs weren’t restricted in size. Today, however, PCBs are smaller than ever before and sometimes even ultra-thin and flexible. Designers are now forced to put more powerful and complex PCBs on smaller boards. Unfortunately, the close proximity of components and traces increases the chances of failure. This means that PCB designers are investing significant resources into designing the most efficient and effective PCB layouts possible.
How will the heat generated by a laser beam affect my board and components during depaneling? Will it melt edge components into an ugly heap? Or demolish thin flex materials into an unrecognizable blob? We get these worst case scenario questions all the time from PCB designers and manufacturers who have relied on mechanical routers, manual cutters, and other traditional depaneling machines throughout their careers. So it is no wonder that there’s an ongoing concern about a laser’s heat affective zone (HAZ), and the thermal effect on edge components in particular.
Flexibility is a good thing if you’re an Olympic gymnast or Cirque du Soleil performer – and it’s essential for PCB designers and manufacturers whose prototypes and end products demand precision etching on flex PCB materials. For the past 40 years, standard mechanical PCB milling systems have been the tools of choice for straightforward milling operations, and in some cases, they’ve been great performers for flex PCB etching as well. LPKF’s top-performing ProtoMat mechanical PCB milling systems, for example, feature faster spindle speeds, low runout and high resolution for working with substrates as thin as 5 mil for single-sided designs and traces, and spacing as small as 4 mil. All good stuff, so how could it get even better? Laser.
It seems like there are more myths about UV laser depaneling than there are about the Loch Ness Monster. But unlike old Nessie, UV laser depaneling myths are much easier to debunk.
“…There will be a rush charge for that.”
“…We should have that for you in two days.”
“…We’re a little backed up right now, but we’ll get to it ASAP.”
If you’re stuck outsourcing your prototype PCB designs, you’ve probably heard these excuses for as long as you can remember. Fortunately, now you have another option.
Fabricating single layer prototype PCBs is fairly straightforward and as a result, more and more organizations are bringing this process in-house. Quicker turnaround times, increased flexibility, and the cost savings compared to outsourcing make a compelling argument. But what happens if multi-layer prototypes are needed? The good news is that it is now possible to process advanced multi-layer designs in house as well. Best of all, the same benefits of bringing single layer fabrication in-house still apply – and when you are processing designs with up to 8-layers the payoff is exponentially bigger.