Simple Changes to Banish Your Idle Production Line: Part Two

In Part One, we began discussing a few simple ways to ensure your PCB manufacturing process is operating efficiently. A well-operating manufacturing process will help prevent costly factory shutdowns and eliminate the need to re-manufacture products because of defects. Previously, we touched upon the importance of understanding your projects, maintaining adequate inventory stockpiles, and using software to monitor the entirety of your production floor. In Part Two, we’ll further expand on the idea and offer more solutions for improving your manufacturing process.

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UV Lasers: The Only Choice for The Future of PCB Depaneling

Up until now, two primary methods of circuit board depaneling have dominated the market: Mechanical depaneling for durable boards and CO2 lasers for those with more precise needs. But as technology advanced, current circuit board designs have failed to keep up with the increasing demands of various industries. Thankfully, flexible circuit boards have answered the call and designers are flocking to them for the versatility, weight and size reduction, and intricacy that square, rigid boards lack.

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Simple Changes to Banish Your Idle Production Line: Part One

If you’ve ever stared at an idle production floor and wondered what went wrong, you’re not alone. Looking at a non-operating PCB manufacturing floor is truly like watching money go out the window. All you can do is call your clients and explain to them why their shipment is going to be late. But it wouldn’t have to be this way if your PCB manufacturing process was streamlined and efficient. Unfortunately, many manufacturers consistently focus on soliciting new clients, rather than taking the time required to improve services for their incumbent customers. In Part one of this two-part series, we’ve outlined some easy steps you can take to ensure that your production line is living up to its real potential.

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PCB Depaneling: The Best Methods for Each PCB Design

The most cost-effective method of producing circuit boards is by printing multiple circuit boards onto a panel. These panels must then be separated into the smaller, individual boards the customer ordered. This process is called depaneling. Years ago, this process was painstakingly done by hand, but as circuit boards got thinner and more fragile, these manual methods quickly became impossible and unaffordable. Today, there are a slew of different technologies available to depanel circuit boards, each with their strengths and weaknesses. In this article, we will explore those differences.

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[Infographic] How UV Lasers Overcome the Challenges of Mechanical Depaneling

Laser depaneling systems have been gaining popularity over recent years. Mechanical depaneling is done with routing, die cutting, and dicing saw methods. Use this infographic to learn the differences between these two depaneling methods and how they could be affecting your bottom line. 

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